TY - GEN
T1 - Minimizing PVT-Variability by Exploiting the Zero Temperature Coefficient (ZTC) for Robust Delay Fault Testing
AU - Jafarzadeh, Hanieh
AU - Klemme, Florian
AU - Reimer, Jan Dennis
AU - Amrouch, Hussam
AU - Hellebrand, Sybille
AU - Wunderlich, Hans Joachim
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Process, Voltage, Temperature (PVT) variations impede the test generation for Small Delay Faults (SDFs) significantly as test patterns effective for one circuit instance may not be valid for a different one. Temperature-induced timing variations in FinFET and Gate-All-Around (GAA) technologies are especially severe due to temperature fluctuations and self-heating. Depending on the supply voltage, they show the Temperature Effect Inversion (TEI) which describes the increase of the circuit speed with increasing temperature. The Zero Temperature Coefficient (ZTC) specifies a supply voltage where TEI approaches 0, and the optimal voltage is determined, such that the effects of temperature-induced variability are minimized. Simulation results are reported, which demonstrate that test generation at the ZTC voltage leads to higher fault coverage of SDFs while using significantly less test patterns.
AB - Process, Voltage, Temperature (PVT) variations impede the test generation for Small Delay Faults (SDFs) significantly as test patterns effective for one circuit instance may not be valid for a different one. Temperature-induced timing variations in FinFET and Gate-All-Around (GAA) technologies are especially severe due to temperature fluctuations and self-heating. Depending on the supply voltage, they show the Temperature Effect Inversion (TEI) which describes the increase of the circuit speed with increasing temperature. The Zero Temperature Coefficient (ZTC) specifies a supply voltage where TEI approaches 0, and the optimal voltage is determined, such that the effects of temperature-induced variability are minimized. Simulation results are reported, which demonstrate that test generation at the ZTC voltage leads to higher fault coverage of SDFs while using significantly less test patterns.
UR - http://www.scopus.com/inward/record.url?scp=85212948896&partnerID=8YFLogxK
U2 - 10.1109/ITC51657.2024.00013
DO - 10.1109/ITC51657.2024.00013
M3 - Conference contribution
AN - SCOPUS:85212948896
T3 - Proceedings - International Test Conference
SP - 26
EP - 30
BT - Proceedings - 2024 IEEE International Test Conference, ITC 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE International Test Conference, ITC 2024
Y2 - 3 November 2024 through 8 November 2024
ER -