TY - GEN
T1 - Miniaturisierung hochsensitiver, hitzdrahtbasierter Massenflusssensoren mit Hilfe von Halbleiterfertigungstechnologie
AU - Seidl, Martin
AU - Schrag, Gabriele
AU - Tumpold, David
AU - Klein, Wolfgang
N1 - Publisher Copyright:
© VDE VERLAG GMBH · Berlin · Offenbach
PY - 2021
Y1 - 2021
N2 - We developed a highly sensitive fully integrated mass flow sensor by combining the superior operation principle and sensitivity of conventional, freely suspended macroscopic hot-wire anemometers with the advantages of miniaturized, integrated silicon sensors. This increases the measurement precision tremendously while, at the same time, covering an extremely large measurement range from several µl/min up to several ml/min. The novel concept distinguishes itself by the assembly of thermo-resistive microstructures, suspended above a through-hole processed through the cross section of the silicon chip, which minimizes thermal leakage from the sensing elements into the substrate, maximizes the thermal coupling to the fluid, and, thus, yields an at least twofold increase in measurement resolution compared to state-of-the-art industrial solutions. Manufactured in standard semiconductor technology, it is ready for cost-effective mass-production.
AB - We developed a highly sensitive fully integrated mass flow sensor by combining the superior operation principle and sensitivity of conventional, freely suspended macroscopic hot-wire anemometers with the advantages of miniaturized, integrated silicon sensors. This increases the measurement precision tremendously while, at the same time, covering an extremely large measurement range from several µl/min up to several ml/min. The novel concept distinguishes itself by the assembly of thermo-resistive microstructures, suspended above a through-hole processed through the cross section of the silicon chip, which minimizes thermal leakage from the sensing elements into the substrate, maximizes the thermal coupling to the fluid, and, thus, yields an at least twofold increase in measurement resolution compared to state-of-the-art industrial solutions. Manufactured in standard semiconductor technology, it is ready for cost-effective mass-production.
UR - http://www.scopus.com/inward/record.url?scp=85125176994&partnerID=8YFLogxK
M3 - Konferenzbeitrag
AN - SCOPUS:85125176994
T3 - MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings
SP - 347
EP - 350
BT - MikroSystemTechnik Kongress 2021
PB - VDE VERLAG GMBH
T2 - MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte - MikroSystemTechnik Congress 2021: Microelectronics, Microsystems Engineering and their Applications - Innovative Products for Future-Oriented Markets
Y2 - 8 November 2021 through 10 November 2021
ER -