TY - GEN
T1 - Metal adhesion strength of metallized films, peel tests
AU - Kucukpinar, E.
AU - Noller, K.
AU - Jesdinszki, M.
AU - Rodler, N.
AU - Struller, C.
AU - Cassio, V.
AU - Blondin, D.
AU - Langowski, H. C.
N1 - Publisher Copyright:
© 2015 TAPPI Press. All rights reserved.
PY - 2015
Y1 - 2015
N2 - • There is a lack of test methodologies for metal adhesion on polymeric substrates. Current measurement; standards are largely Incomplete. Available EAA-peel tests are not always applicable by the metallizing companies due to the overstretching of the EAA-film during the peel test. Mechanically stronger heat sealable | films may be more promising. • Peel test results of laminates are influenced by several factors, which are usually not recorded during the; measurements such as peel distance, peel-off angle, thickness, elastic and viscoelastic properties of the! peeled material. Relations to practical load conditions are still not known. • There is still a considerable amount of work to be done about development of adhesion tests.
AB - • There is a lack of test methodologies for metal adhesion on polymeric substrates. Current measurement; standards are largely Incomplete. Available EAA-peel tests are not always applicable by the metallizing companies due to the overstretching of the EAA-film during the peel test. Mechanically stronger heat sealable | films may be more promising. • Peel test results of laminates are influenced by several factors, which are usually not recorded during the; measurements such as peel distance, peel-off angle, thickness, elastic and viscoelastic properties of the! peeled material. Relations to practical load conditions are still not known. • There is still a considerable amount of work to be done about development of adhesion tests.
UR - http://www.scopus.com/inward/record.url?scp=85050243400&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85050243400
T3 - TAPPI European PLACE Conference
SP - 464
BT - 15th TAPPI European PLACE Conference 2015
PB - TAPPI Press
T2 - 15th TAPPI European PLACE Conference 2015
Y2 - 11 May 2015 through 13 May 2015
ER -