TY - GEN
T1 - Long-term investigations of RF-MEMS switches on failure mechanisms induced by dielectric charging
AU - Behielt, Regine
AU - Künzig, Thomas
AU - Schrag, Gabriele
N1 - Publisher Copyright:
© 2014 Circuits Multi Projets - CMP.
PY - 2014/3/9
Y1 - 2014/3/9
N2 - We present an extensive study on dielectric charging effects, one of the major problems that limit the reliability of electrostatically actuated RF-MEMS switches and, thus, their way into a broad commercial application. For the first time, we are able to provide quantitative statements on the amount of charge injected into the dielectric layers. They result from monitoring the long-term evolution of the switching voltages of the device under test recorded by a novel, on-purpose developed measurement set-up, which enables temperature-dependent investigations. Furthermore, the origin of the parasitic charges, their impact on the switching operation and measures to remove them from the dielectric layers could be identified.
AB - We present an extensive study on dielectric charging effects, one of the major problems that limit the reliability of electrostatically actuated RF-MEMS switches and, thus, their way into a broad commercial application. For the first time, we are able to provide quantitative statements on the amount of charge injected into the dielectric layers. They result from monitoring the long-term evolution of the switching voltages of the device under test recorded by a novel, on-purpose developed measurement set-up, which enables temperature-dependent investigations. Furthermore, the origin of the parasitic charges, their impact on the switching operation and measures to remove them from the dielectric layers could be identified.
KW - RF-MEMS switch
KW - dielectric charging
KW - electromechanical model
KW - long-term characterization
UR - http://www.scopus.com/inward/record.url?scp=84946690818&partnerID=8YFLogxK
U2 - 10.1109/DTIP.2014.7056675
DO - 10.1109/DTIP.2014.7056675
M3 - Conference contribution
AN - SCOPUS:84946690818
T3 - DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
BT - DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014
Y2 - 2 April 2014 through 4 April 2014
ER -