Abstract
The importance of assuring proper solderability in the manufacture of surface mounted devices (SMD's) is pointed out. It is also essential to have available a satisfactory testing method to determine the quality of soldering operations. This is realized with the aid of a wetting balance which is discussed.
| Translated title of the contribution | Testing of Solderability of Surface Mounted Devices by Means of a Wetting Balance. |
|---|---|
| Original language | German |
| Pages (from-to) | 48-51, 54 |
| Journal | Elektronik-Produktion & Pruftechnik |
| Issue number | 10 |
| State | Published - Oct 1987 |
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