LOETBARKEITSPRUEFUNG AN SMDS MIT DER BENETZUNGSWAAGE.

Translated title of the contribution: Testing of Solderability of Surface Mounted Devices by Means of a Wetting Balance.

Kh G. Schmitt-Thomas, R. Becker, M. Groll

Research output: Contribution to journalArticlepeer-review

Abstract

The importance of assuring proper solderability in the manufacture of surface mounted devices (SMD's) is pointed out. It is also essential to have available a satisfactory testing method to determine the quality of soldering operations. This is realized with the aid of a wetting balance which is discussed.

Translated title of the contributionTesting of Solderability of Surface Mounted Devices by Means of a Wetting Balance.
Original languageGerman
Pages (from-to)48-51, 54
JournalElektronik-Produktion & Pruftechnik
Issue number10
StatePublished - Oct 1987

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