Abstract
The importance of assuring proper solderability in the manufacture of surface mounted devices (SMD's) is pointed out. It is also essential to have available a satisfactory testing method to determine the quality of soldering operations. This is realized with the aid of a wetting balance which is discussed.
Translated title of the contribution | Testing of Solderability of Surface Mounted Devices by Means of a Wetting Balance. |
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Original language | German |
Pages (from-to) | 48-51, 54 |
Journal | Elektronik-Produktion & Pruftechnik |
Issue number | 10 |
State | Published - Oct 1987 |