Laser-processing for patterned and free-standing nitride films

Films of GaN and related materials can be processed by methods that invoke thermal decomposition, induced by intense illumination with a pulsed laser. At elevated temperatures, the nitride semiconductors undergo decomposition, with the effusion of nitrogen gas. We exploit this mechanism as an alternative to etching for the patterning of nitride films and for the opening of buried interfaces. Films of GaN have been etched to a depth of 1 μm in less than three seconds. This interface decomposition allows in particular the separation of nitride films from transparent growth substrates such as sapphire.