TY - JOUR
T1 - Integration of Surface-Mount Devices in Microsystems Using Tracks Consisting of Nanoparticles
AU - Mitteramskogler, Tina
AU - Fuchsluger, Andreas
AU - Ecker, Rafael
AU - Lang, Sebastian
AU - Wilfinger, Thomas
AU - Wille, Robert
AU - Jakoby, Bernhard
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2024
Y1 - 2024
N2 - The success of semiconductor industry, providing a high- volume, high-accuracy fabrication method of sensor chips, has caused sensors to be omnipresent in everyday consumer products. Typically, these sensors are enclosed into sensor packages and further integrated onto printed circuit boards since, for the connection to the outer world, several length scales have to be bridged. In this work, we show how surface-mount devices (SMDs) can be directly integrated onto poly(methyl methacrylate) (PMMA) chips through the use of open microchannels. To this end, the SMDs are directly placed onto structured PMMA plates with open microchannels connecting them to dedicated liquid reservoirs. When introducing conductive inks to those reservoirs, capillary forces draw the liquid toward the SMDs and ensure the electrical connection between the liquid reservoir and the SMDs themselves. With the addition of crossings and meandering conductive lines, this process can be used for the fabrication of electrical networks out of individual SMD components directly on a PMMA substrate.
AB - The success of semiconductor industry, providing a high- volume, high-accuracy fabrication method of sensor chips, has caused sensors to be omnipresent in everyday consumer products. Typically, these sensors are enclosed into sensor packages and further integrated onto printed circuit boards since, for the connection to the outer world, several length scales have to be bridged. In this work, we show how surface-mount devices (SMDs) can be directly integrated onto poly(methyl methacrylate) (PMMA) chips through the use of open microchannels. To this end, the SMDs are directly placed onto structured PMMA plates with open microchannels connecting them to dedicated liquid reservoirs. When introducing conductive inks to those reservoirs, capillary forces draw the liquid toward the SMDs and ensure the electrical connection between the liquid reservoir and the SMDs themselves. With the addition of crossings and meandering conductive lines, this process can be used for the fabrication of electrical networks out of individual SMD components directly on a PMMA substrate.
KW - Sensor systems
KW - integration
KW - laser writing
KW - nanoparticle ink
KW - poly(methyl methacrylate) (PMMA)
KW - surface-mount devices (SMDs)
UR - http://www.scopus.com/inward/record.url?scp=85204218205&partnerID=8YFLogxK
U2 - 10.1109/LSENS.2024.3460969
DO - 10.1109/LSENS.2024.3460969
M3 - Article
AN - SCOPUS:85204218205
SN - 2475-1472
VL - 8
JO - IEEE Sensors Letters
JF - IEEE Sensors Letters
IS - 10
M1 - 5504204
ER -