TY - GEN
T1 - Influence of loss mechanisms on high Q whispering gallery mode (WGM) resonators suitable for RF applications
AU - Silva Cortes, V.
AU - Binder, J.
AU - Fischer, G.
AU - Hagelauer, A.
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/2
Y1 - 2017/7/2
N2 - For a novel approach of resonators operating at radio frequencies (RF), extremely high quality factors (Q) in the order of Q > 100,000 are required. This work presents the impact on the Q-factors of the fundamental loss mechanisms of a micro-electro-mechanical systems (MEMS) resonator based on a disk structure working in radial bulk and whispering gallery modes (WGM). The theoretical feasibility of high Q is examined with finite element method (FEM) simulations. Thermoelastic damping (TED) and anchor losses are analyzed with FEM simulations, allowing to determine the dominant source of dissipation. Furthermore, the shortcomings of mechanical coupling in resonator arrays has been analyzed.
AB - For a novel approach of resonators operating at radio frequencies (RF), extremely high quality factors (Q) in the order of Q > 100,000 are required. This work presents the impact on the Q-factors of the fundamental loss mechanisms of a micro-electro-mechanical systems (MEMS) resonator based on a disk structure working in radial bulk and whispering gallery modes (WGM). The theoretical feasibility of high Q is examined with finite element method (FEM) simulations. Thermoelastic damping (TED) and anchor losses are analyzed with FEM simulations, allowing to determine the dominant source of dissipation. Furthermore, the shortcomings of mechanical coupling in resonator arrays has been analyzed.
UR - http://www.scopus.com/inward/record.url?scp=85050505280&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2017.8276917
DO - 10.1109/EDAPS.2017.8276917
M3 - Conference contribution
AN - SCOPUS:85050505280
T3 - 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
SP - 1
EP - 3
BT - 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
Y2 - 14 December 2017 through 16 December 2017
ER -