Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology

Christopher Beck; Herman Jalli Ng; Roman Agethen; Mehran PourMousavi; Hans Peter Forstner; Maciej Wojnowski; Klaus Pressel; Robert Weigel; Amelie Hagelauer; Dietmar Kissinger

doi:10.1109/JSEN.2016.2587731

Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology

Christopher Beck, Herman Jalli Ng, Roman Agethen, Mehran PourMousavi, Hans Peter Forstner, Maciej Wojnowski, Klaus Pressel, Robert Weigel, Amelie Hagelauer, Dietmar Kissinger

Research output: Contribution to journal › Article › peer-review

41 Scopus citations

Abstract

We present highly integrated 60-GHz radar transceivers for industrial sensor applications. The bistatic and monostatic transceivers are implemented in the SiGe bipolar technology and packaged using the embedded wafer-level ball grid array technology that allows for direct embedding of the antennas in the package redistribution layer. In this way, very compact and efficient radar frontends comprising all millimeter-wave components can be implemented in an 8×8 mm² package. These frontends were soldered on a standard low-cost printed circuit board based on FR4 material. For verification of the proposed frontends, an frequency-modulated continuous wave (FMCW) radar system was developed and set up within this paper. Theoretical considerations and simulations as well as corresponding measurements were carried out for the evaluation of the designed system. The demonstrator results of these embedded radar sensors show an excellent system performance at a high integration level.

Original language	English
Article number	7506030
Pages (from-to)	6566-6578
Number of pages	13
Journal	IEEE Sensors Journal
Volume	16
Issue number	17
DOIs	https://doi.org/10.1109/JSEN.2016.2587731
State	Published - 1 Sep 2016
Externally published	Yes

Keywords

Millimeter-wave circuits
SiGe RFICs
SiP modules
packaging
radar systems

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10.1109/JSEN.2016.2587731

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title = "Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology",

abstract = "We present highly integrated 60-GHz radar transceivers for industrial sensor applications. The bistatic and monostatic transceivers are implemented in the SiGe bipolar technology and packaged using the embedded wafer-level ball grid array technology that allows for direct embedding of the antennas in the package redistribution layer. In this way, very compact and efficient radar frontends comprising all millimeter-wave components can be implemented in an 8×8 mm2 package. These frontends were soldered on a standard low-cost printed circuit board based on FR4 material. For verification of the proposed frontends, an frequency-modulated continuous wave (FMCW) radar system was developed and set up within this paper. Theoretical considerations and simulations as well as corresponding measurements were carried out for the evaluation of the designed system. The demonstrator results of these embedded radar sensors show an excellent system performance at a high integration level.",

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AU - Agethen, Roman

AU - PourMousavi, Mehran

AU - Forstner, Hans Peter

AU - Wojnowski, Maciej

AU - Pressel, Klaus

AU - Weigel, Robert

AU - Hagelauer, Amelie

AU - Kissinger, Dietmar

PY - 2016/9/1

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AB - We present highly integrated 60-GHz radar transceivers for industrial sensor applications. The bistatic and monostatic transceivers are implemented in the SiGe bipolar technology and packaged using the embedded wafer-level ball grid array technology that allows for direct embedding of the antennas in the package redistribution layer. In this way, very compact and efficient radar frontends comprising all millimeter-wave components can be implemented in an 8×8 mm2 package. These frontends were soldered on a standard low-cost printed circuit board based on FR4 material. For verification of the proposed frontends, an frequency-modulated continuous wave (FMCW) radar system was developed and set up within this paper. Theoretical considerations and simulations as well as corresponding measurements were carried out for the evaluation of the designed system. The demonstrator results of these embedded radar sensors show an excellent system performance at a high integration level.

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Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology

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Keywords

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