Indium solder printing for low temperature applications and modeling of a Droplet generator

Oliver S. Kessling; Konstantin Werner; Franz Irlinger; Tim C. Lüth

doi:10.1109/ROBIO.2010.5723434

Indium solder printing for low temperature applications and modeling of a Droplet generator

Oliver S. Kessling
, Konstantin Werner
, Franz Irlinger
, Tim C. Lüth

Chair of Micro Technology and Medical Device Technology

Technical University of Munich

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

10 Scopus citations

Abstract

In this paper a system for solder printing is presented. With the printing system solder bumps can be directly printed on a substrate. The printhead is actuated by an electro-magnetic working principle. After printing the bumps, flip-chips can be placed and reflow soldered. A model to describe the printhead is presented. A differential equation for the movement of the actuated piston was developed. With the help of the conservation of energy and momentum as well as the continuity condition the droplet velocity and droplet volume can be calculated. The calculated values are compared with experimental data.

Original language	English
Title of host publication	2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010
Pages	833-838
Number of pages	6
DOIs	https://doi.org/10.1109/ROBIO.2010.5723434
State	Published - 2010
Event	2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010 - Tianjin, China Duration: 14 Dec 2010 → 18 Dec 2010

Publication series

Name	2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010

Conference

Conference	2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010
Country/Territory	China
City	Tianjin
Period	14/12/10 → 18/12/10

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10.1109/ROBIO.2010.5723434

Cite this

Kessling, O. S., Werner, K., Irlinger, F., & Lüth, T. C. (2010). Indium solder printing for low temperature applications and modeling of a Droplet generator. In 2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010 (pp. 833-838). Article 5723434 (2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010). https://doi.org/10.1109/ROBIO.2010.5723434

@inproceedings{da2bfa9cb2c84224ab935c19278f2509,

title = "Indium solder printing for low temperature applications and modeling of a Droplet generator",

abstract = "In this paper a system for solder printing is presented. With the printing system solder bumps can be directly printed on a substrate. The printhead is actuated by an electro-magnetic working principle. After printing the bumps, flip-chips can be placed and reflow soldered. A model to describe the printhead is presented. A differential equation for the movement of the actuated piston was developed. With the help of the conservation of energy and momentum as well as the continuity condition the droplet velocity and droplet volume can be calculated. The calculated values are compared with experimental data.",

author = "Kessling, \{Oliver S.\} and Konstantin Werner and Franz Irlinger and L{\"u}th, \{Tim C.\}",

year = "2010",

doi = "10.1109/ROBIO.2010.5723434",

language = "English",

isbn = "9781424493173",

series = "2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010",

pages = "833--838",

booktitle = "2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010",

note = "2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010 ; Conference date: 14-12-2010 Through 18-12-2010",

}

Kessling, OS, Werner, K, Irlinger, F & Lüth, TC 2010, Indium solder printing for low temperature applications and modeling of a Droplet generator. in 2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010., 5723434, 2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010, pp. 833-838, 2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010, Tianjin, China, 14/12/10. https://doi.org/10.1109/ROBIO.2010.5723434

Indium solder printing for low temperature applications and modeling of a Droplet generator. / Kessling, Oliver S.; Werner, Konstantin; Irlinger, Franz et al.
2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010. 2010. p. 833-838 5723434 (2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Indium solder printing for low temperature applications and modeling of a Droplet generator

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AU - Werner, Konstantin

AU - Irlinger, Franz

AU - Lüth, Tim C.

PY - 2010

Y1 - 2010

N2 - In this paper a system for solder printing is presented. With the printing system solder bumps can be directly printed on a substrate. The printhead is actuated by an electro-magnetic working principle. After printing the bumps, flip-chips can be placed and reflow soldered. A model to describe the printhead is presented. A differential equation for the movement of the actuated piston was developed. With the help of the conservation of energy and momentum as well as the continuity condition the droplet velocity and droplet volume can be calculated. The calculated values are compared with experimental data.

AB - In this paper a system for solder printing is presented. With the printing system solder bumps can be directly printed on a substrate. The printhead is actuated by an electro-magnetic working principle. After printing the bumps, flip-chips can be placed and reflow soldered. A model to describe the printhead is presented. A differential equation for the movement of the actuated piston was developed. With the help of the conservation of energy and momentum as well as the continuity condition the droplet velocity and droplet volume can be calculated. The calculated values are compared with experimental data.

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U2 - 10.1109/ROBIO.2010.5723434

DO - 10.1109/ROBIO.2010.5723434

M3 - Conference contribution

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SN - 9781424493173

T3 - 2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010

SP - 833

EP - 838

BT - 2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010

T2 - 2010 IEEE International Conference on Robotics and Biomimetics, ROBIO 2010

Y2 - 14 December 2010 through 18 December 2010

ER -

Indium solder printing for low temperature applications and modeling of a Droplet generator

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