Impact of STI-induced stress, inverse narrow width effect, and statistical VTH variations on leakage currents in 120 nm CMOS

Christian Pacha, Martin Bach, Klaus Von Arnim, Ralf Brederlow, Doris Schmitt-Landsiede, Peter Seegebrecht, Jörg Berthold, Roland Thewes

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

50 Scopus citations

Abstract

Leakage currents in 120 nm CMOS technology are depending on STI-induced Stress (STIS), Inverse Narrow-Width Effect (INWE), and statistical threshold voltage variations. In this paper we analyze the impact of theses effects on the gate-width dependence of the device off-current density. A threshold voltage model is proposed to describe the observed off-current minimum. STIS dominates the device behavior for large gate widths while INWE determines the off-current for gate widths below I jum. Statistical threshold voltage variations are relevant for minimum-sized devices.

Original languageEnglish
Title of host publicationESSCIRC 2004 - Proceedings of the 34th European Solid-State Device Research Conference
EditorsR.P. Mertens, C.L. Claeys
Pages397-400
Number of pages4
StatePublished - 2004
Externally publishedYes
EventESSCIRC 2004 - Proceedings of the 34th European Solid-State Device Research Conference - Leuven, Belgium
Duration: 21 Sep 200423 Sep 2004

Publication series

NameESSCIRC 2004 - Proceedings of the 34th European Solid-State Device Research Conference

Conference

ConferenceESSCIRC 2004 - Proceedings of the 34th European Solid-State Device Research Conference
Country/TerritoryBelgium
CityLeuven
Period21/09/0423/09/04

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