Impact of Extrinsic Variation Sources on the Device-to-Device Variation in Ferroelectric FET

Kai Ni, Aniket Gupta, Om Prakash, Simon Thomann, X. Sharon Hu, Hussam Amrouch

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

48 Scopus citations

Abstract

Variation due to the intrinsic ferroelectric switching process has been known to cause serious challenges for the FeFET variation control. This work complements that understanding by investigating, for the first time, the impact of extrinsic variation sources on the variation of FeFETs. We show that: 1) poorer electrostatics in a FeFET due to a thicker oxide does not degrade the overall variation when comparing to a baseline FinFET with an equal oxide thickness as the FeFET and a thin oxide reference transistor; 2) variation sources from the ferroelectric parameters constitute a significant portion in the overall FeFET variation, whereas the underlying transistor variation is marginal. These results highlight that besides the intrinsic ferroelectric switching control, ferroelectric parameters uniformity should also be one of the primary optimization targets towards building reliable FeFET-based non-volatile memory.

Original languageEnglish
Title of host publication2020 IEEE International Reliability Physics Symposium, IRPS 2020 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728131993
DOIs
StatePublished - Apr 2020
Externally publishedYes
Event2020 IEEE International Reliability Physics Symposium, IRPS 2020 - Virtual, Online, United States
Duration: 28 Apr 202030 May 2020

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
Volume2020-April
ISSN (Print)1541-7026

Conference

Conference2020 IEEE International Reliability Physics Symposium, IRPS 2020
Country/TerritoryUnited States
CityVirtual, Online
Period28/04/2030/05/20

Keywords

  • FeFET
  • Ferroelectric
  • FinFET
  • HfO
  • NVM
  • Nonvolatile Memory
  • Process variation
  • Reliability
  • TCAD

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