TY - GEN
T1 - Humidity and corrosion susceptibility of molded packages under mechanical impact Novel package level impact test to provoke micro-damage
AU - Udiljak, Dominik
AU - Pufall, Reinhard
AU - Reuther, Georg M.
AU - Boudaden, Jamila
AU - Ramm, Peter
AU - Schrag, Gabriele
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - In this study we propose a new approach to assess micro-damage in semiconductor packages, such as cracks or delamination. The main goal is to identify micro-damage, which does not instantly result in electrical failure of a component, but rather decreases humidity resistance and, hence, results in increased risk of early electrical package failure in humid environments. The proposed test method consists of two consecutive stress tests: 1) Package level impact test and 2) In-situ Highly Accelerated Stress Test. As preliminary work, this study deals with the setup of the impact tester and first experiments on simple molding compound samples and packages. We implemented a simulation model of the impact tester in order to define damage criteria and predict failures of different package designs in the future. The simulation model was partly calibrated with the help of experimental data, namely drop weight fall time, shock acceleration and plastic deformation of molding compound samples.
AB - In this study we propose a new approach to assess micro-damage in semiconductor packages, such as cracks or delamination. The main goal is to identify micro-damage, which does not instantly result in electrical failure of a component, but rather decreases humidity resistance and, hence, results in increased risk of early electrical package failure in humid environments. The proposed test method consists of two consecutive stress tests: 1) Package level impact test and 2) In-situ Highly Accelerated Stress Test. As preliminary work, this study deals with the setup of the impact tester and first experiments on simple molding compound samples and packages. We implemented a simulation model of the impact tester in order to define damage criteria and predict failures of different package designs in the future. The simulation model was partly calibrated with the help of experimental data, namely drop weight fall time, shock acceleration and plastic deformation of molding compound samples.
UR - http://www.scopus.com/inward/record.url?scp=85129523871&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE54907.2022.9758867
DO - 10.1109/EuroSimE54907.2022.9758867
M3 - Conference contribution
AN - SCOPUS:85129523871
T3 - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
BT - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
Y2 - 25 April 2022 through 27 April 2022
ER -