TY - JOUR
T1 - High-throughput synthesis of modified Fresnel zone plate arrays via ion beam lithography
AU - Keskinbora, Kahraman
AU - Sanli, Umut Tunca
AU - Baluktsian, Margarita
AU - Grévent, Corinne
AU - Weigand, Markus
AU - Schütz, Gisela
N1 - Publisher Copyright:
© 2018 Keskinbora et al.
PY - 2018
Y1 - 2018
N2 - Fresnel zone plates (FZP) are diffractive photonic devices used for high-resolution imaging and lithography at short wavelengths. Their fabrication requires nano-machining capabilities with exceptional precision and strict tolerances such as those enabled by modern lithography methods. In particular, ion beam lithography (IBL) is a noteworthy method thanks to its robust direct writing/milling capability. IBL allows for rapid prototyping of high-resolution FZPs that can be used for high-resolution imaging at soft X-ray energies. Here, we discuss improvements in the process enabling us to write zones down to 15 nm in width, achieving an effective outermost zone width of 30 nm. With a 35% reduction in process time and an increase in resolution by 26% compared to our previous results, we were able to resolve 21 nm features of a test sample using the FZP. The new process conditions are then applied for fabrication of large arrays of high-resolution zone plates. Results show that relatively large areas can be decorated with nanostructured devices via IBL by using multipurpose SEM/FIB instruments with potential applications in FEL focusing, extreme UV and soft X-ray lithography and as wavefront sensing devices for beam diagnostics.
AB - Fresnel zone plates (FZP) are diffractive photonic devices used for high-resolution imaging and lithography at short wavelengths. Their fabrication requires nano-machining capabilities with exceptional precision and strict tolerances such as those enabled by modern lithography methods. In particular, ion beam lithography (IBL) is a noteworthy method thanks to its robust direct writing/milling capability. IBL allows for rapid prototyping of high-resolution FZPs that can be used for high-resolution imaging at soft X-ray energies. Here, we discuss improvements in the process enabling us to write zones down to 15 nm in width, achieving an effective outermost zone width of 30 nm. With a 35% reduction in process time and an increase in resolution by 26% compared to our previous results, we were able to resolve 21 nm features of a test sample using the FZP. The new process conditions are then applied for fabrication of large arrays of high-resolution zone plates. Results show that relatively large areas can be decorated with nanostructured devices via IBL by using multipurpose SEM/FIB instruments with potential applications in FEL focusing, extreme UV and soft X-ray lithography and as wavefront sensing devices for beam diagnostics.
KW - Extreme ultraviolet (EUV) radiation
KW - Focused ion beam (FIB)
KW - Fresnel zone plate
KW - Ion beam lithography (IBL)
KW - Nanopatterning
KW - Soft X-rays
UR - http://www.scopus.com/inward/record.url?scp=85052945867&partnerID=8YFLogxK
U2 - 10.3762/bjnano.9.194
DO - 10.3762/bjnano.9.194
M3 - Article
AN - SCOPUS:85052945867
SN - 2190-4286
VL - 9
SP - 2049
EP - 2056
JO - Beilstein Journal of Nanotechnology
JF - Beilstein Journal of Nanotechnology
IS - 1
ER -