High-quality YBa₂Cu₃O₇ films on 4-in. Wafers of sapphire, gallium arsenide, and silicon

Our technique of reactive thermal co-evaporation has been extended to fabricate large films (up to 4 in.) of YBa₂Cu₃O₇ with high quality. A rotating substrate holder is used to separate the deposition and oxidation processes. This allows free access of the metal vapors. As large substrate wafers we use Al₂O₃, Si, and GaAs with buffer layers of CeO₂, YSZ, and MgO, respectively. On all substrates, the uniformity of thickness and composition was better than 2%. Inductively measured T_c and j_c(77 K) were 87.5±0.2 K and >1×10⁶ A/cm², respectively, across the full wafer area. This holds also for GaAs substrates due to a new procedure of capping by Si₃N₄.