Growth of GaN/AlN and AlGaN by MOCVD using triethylgallium and tritertiarybutylaluminium

O. Ambacher, R. Dimitrov, D. Lentz, T. Metzger, W. Rieger, M. Stutzmann

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Abstract

Films of aluminium nitride (AlN) with thicknesses in the range from 200 to 3600 Å have been deposited at 1050°C by low-pressure MOCVD. Using an alternative precursor, tritertiarybutylaluminium (tBu3Al), and ammonia (NH3), we have grown AlN on sapphire (c-Al2O3). At a growth rate of 0.35 μm/h, the FWHM of the rocking curve measured by X-ray diffraction was 150 arcsec. Therefore, we used the thin AlN films as buffer layers for the deposition of gallium nitride (GaN) at 950°C using triethylgallium (Et3Ga). Aluminium gallium nitride (AlxGa1 - xN) with aluminium contents x from 0 to 0.5 were grown using a mixture of Et3Ga and tBu3Al. The structural and optical properties of GaN, AlGaN and AlN were verified by X-ray diffraction (XRD), spectrally resolved photoconductivity (SPC), photothermal deflection (PDS) and photoluminescence spectroscopies.

Original languageEnglish
Pages (from-to)335-339
Number of pages5
JournalJournal of Crystal Growth
Volume170
Issue number1-4
DOIs
StatePublished - Jan 1997

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