Full-wave analysis of discontinuities in uniplanar and multiplanar transmission lines using the frequency-domain TLM method

Hang Jin, Rudiger Vahldieck, Peter Russer, Jifu Huang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

This paper introduces a rigorous analysis of a variety of transmission line transition discontinuities and module interconnect assemblies in MMIC and miniature MIC circuits using the frequency-domain TLM method. Numerical results of frequency-dependent s-parameters are presented which include the effect of finite thickness and conductivity of the metallization as well as mode interaction between cascaded discontinuities. The effects of the bonding wire for module assemblies is investigated. It is found that the properties of the interconnect are largely depended on the total length of the wire and are quite insensitive to the shape of the wire. This is in a good agreement with experimental observations.

Original languageEnglish
Title of host publicationDigest IEEE MTT-S International Symposium Digest
PublisherPubl by IEEE
Pages713-716
Number of pages4
ISBN (Print)0780312090
StatePublished - 1993
Externally publishedYes
EventProceedings of the 1993 IEEE MTT-S International Symposium on Circuits and Systems, Part 4 (of 4) - Atlanta, GA, USA
Duration: 14 Jun 199318 Jun 1993

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
Volume2
ISSN (Print)0149-645X

Conference

ConferenceProceedings of the 1993 IEEE MTT-S International Symposium on Circuits and Systems, Part 4 (of 4)
CityAtlanta, GA, USA
Period14/06/9318/06/93

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