Full-System Simulation of Airborne Capacitive Mems Transducers Operating in the Audible and Ultrasonic Regime

Gabriele Bosetti, Johannes Manz, Ulrich Krumbein, Gabriele Schrag

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A compact model of an airborne capacitive acoustic MEMS transducer is generalized to perform predictive full-system simulations in the audible and ultrasonic regime. The model helps to assess and understand the interaction of the device with the surrounding air for frequencies up to 100 kHz while considering acoustic high-frequency effects and sound wave propagation. We successfully simulate transducers with varying design parameters operating under different working scenarios. The predictive power of the model and its potential for full-system design and optimization are highlighted by the very good agreement between simulations and experimental results.

Original languageEnglish
Title of host publication2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages837-840
Number of pages4
ISBN (Electronic)9781728120072
DOIs
StatePublished - Jun 2019
Event20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII - Berlin, Germany
Duration: 23 Jun 201927 Jun 2019

Publication series

Name2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

Conference

Conference20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Country/TerritoryGermany
CityBerlin
Period23/06/1927/06/19

Keywords

  • Acoustic MEMS Transducer
  • Acoustic Transmission Line
  • Audible Regime
  • System-Level Simulation
  • Ultrasonic Regime
  • Virtual Prototyping

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