Framework for teleoperated micro-assembly systems

Gunther Reinhart, Oliver Anton, Michael Ehrenstraßer, Christian Patron, Bernd Petzold

Research output: Contribution to journalConference articlepeer-review

6 Scopus citations

Abstract

Manual assembly of minute parts is currently done using simple devices such as tweezers or magnifying glasses. The operator therefore requires a great deal of concentration for successful assembly. Teleoperated micro-assembly systems are a promising method for overcoming the scaling barrier. However, most of today's telepresence systems are based on proprietary and one-of-a-kind solutions. Frameworks which supply the basic functions of a telepresence system, e.g. to establish flexible communication links that depend on bandwidth requirements or to synchronize distributed components, are not currently available. Large amounts of time and money have to be invested in order to create taskspecific teleoperated micro-assembly systems from scratch. For this reason, an object-oriented framework for telepresence systems that is based on CORBA as a common middleware was developed at the Institute for Machine Tools and Industrial Management (iwb). The framework is based on a distributed architectural concept and is realized in C++. External hardware components such as haptic, video or sensor devices are coupled to the system by means of defined software interfaces. In this case, the special requirements of teleoperation systems have to be considered, e.g. dynamic parameter settings for sensors during operation. Consequently, an architectural concept based on logical sensors has been developed to achieve maximum flexibility and to enable a task-oriented integration of hardware components.

Original languageEnglish
Pages (from-to)86-96
Number of pages11
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4570
DOIs
StatePublished - 2001
EventTelemanipulator and Telepresence Technologies VIII - Newton, MA, United States
Duration: 28 Oct 200128 Oct 2001

Keywords

  • Cost-efficient micro-assembly
  • Integration of joining technologies
  • Sensor integration

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