Failure of power DMOS transistor arrays under unclamped inductive switching stress conditions

A. Icaza Deckelmann, G. Wachutka, J. Krumrey, F. Hirler, R. Henninger

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

The failure of power DMOS transistor arrays under unclamped inductive switching- (UIS-) stress conditions is investigated using continous field-based electrothermal device simulation. With reference to previous work of the authors, progressively deeper insight into the failure mechanism enables its detailed understanding. The temperature and current distributions among parallel DMOS cells in the array indicate that indeed the simulation of one single cell can be used as a reliable means of assessing the safe operating area (SOA) of the transistor array under UIS stress conditions. A comparison with measured data shows reasonable agreement with the simulation results and, thus, corroborates the validity of our model.

Original languageEnglish
Title of host publication2003 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages305-308
Number of pages4
ISBN (Electronic)0780377494, 9780780377493
DOIs
StatePublished - 2003
EventIEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003 - Tsimshatsui, Kowloon, Hong Kong
Duration: 16 Dec 200318 Dec 2003

Publication series

Name2003 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003

Conference

ConferenceIEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003
Country/TerritoryHong Kong
CityTsimshatsui, Kowloon
Period16/12/0318/12/03

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