TY - GEN
T1 - Failure of power DMOS transistor arrays under unclamped inductive switching stress conditions
AU - Icaza Deckelmann, A.
AU - Wachutka, G.
AU - Krumrey, J.
AU - Hirler, F.
AU - Henninger, R.
N1 - Publisher Copyright:
©2003 IEEE.
PY - 2003
Y1 - 2003
N2 - The failure of power DMOS transistor arrays under unclamped inductive switching- (UIS-) stress conditions is investigated using continous field-based electrothermal device simulation. With reference to previous work of the authors, progressively deeper insight into the failure mechanism enables its detailed understanding. The temperature and current distributions among parallel DMOS cells in the array indicate that indeed the simulation of one single cell can be used as a reliable means of assessing the safe operating area (SOA) of the transistor array under UIS stress conditions. A comparison with measured data shows reasonable agreement with the simulation results and, thus, corroborates the validity of our model.
AB - The failure of power DMOS transistor arrays under unclamped inductive switching- (UIS-) stress conditions is investigated using continous field-based electrothermal device simulation. With reference to previous work of the authors, progressively deeper insight into the failure mechanism enables its detailed understanding. The temperature and current distributions among parallel DMOS cells in the array indicate that indeed the simulation of one single cell can be used as a reliable means of assessing the safe operating area (SOA) of the transistor array under UIS stress conditions. A comparison with measured data shows reasonable agreement with the simulation results and, thus, corroborates the validity of our model.
UR - http://www.scopus.com/inward/record.url?scp=84946423252&partnerID=8YFLogxK
U2 - 10.1109/EDSSC.2003.1283537
DO - 10.1109/EDSSC.2003.1283537
M3 - Conference contribution
AN - SCOPUS:84946423252
T3 - 2003 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003
SP - 305
EP - 308
BT - 2003 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC 2003
Y2 - 16 December 2003 through 18 December 2003
ER -