Failure of multiple-cell power DMOS transistors in avalanche operation

  • A. Icaza Deckelmann
  • , G. Wachutka
  • , F. Hirler
  • , J. Krumrey
  • , R. Henninger

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

11 Scopus citations

Abstract

We continued the work presented in [1], showing by multiple-cell device simulation that the failure mechanism found for a single DMOS transistor cell, , indeed applies to a multiple-cell array, when the simplified model is extended to the whole device Structure. Moreover, the current crowding phenomenon predicted by the model in [1] is corroboraied by experimental failure analysis. Current filamentation, which had already been indicated by 2D-simulation could now be demonstrated by means of 3D-simulation. In this context, it showed that a physically rigorous electrothermal transport model is mandatory in order to achieve a good agreement with experimental data.

Original languageEnglish
Title of host publicationESSDERC 2003 - Proceedings of the 33rd European Solid-State Device Research Conference
EditorsJose Franca, Paulo Freitas
PublisherIEEE Computer Society
Pages323-326
Number of pages4
ISBN (Electronic)0780379993
ISBN (Print)9780780379992
DOIs
StatePublished - 2003
Event33rd European Solid-State Device Research Conference, ESSDERC 2003 - Estoril, Portugal
Duration: 16 Sep 200318 Sep 2003

Publication series

NameEuropean Solid-State Device Research Conference
ISSN (Print)1930-8876

Conference

Conference33rd European Solid-State Device Research Conference, ESSDERC 2003
Country/TerritoryPortugal
CityEstoril
Period16/09/0318/09/03

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