TY - GEN
T1 - Extended Approach for Efficient Coupling Strength Determination for Superconducting Qubit
AU - Luo, Zhen
AU - Tsitsilin, Ivan
AU - Schneider, Christian
AU - Dietz, Marco
AU - Hagelauer, Amelie
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - In the design of superconducting quantum chips, the control and readout of the quantum bit (qubit) are realized through interactions with other components in the circuit, such as drive lines, flux lines and readout resonator. Depending on the design, these interactions employ either an inductive or capacitive coupling scheme. Note that every interaction governs critical performance metrics for the chip, including gate fidelity, readout speed, and coherence times, a more effective and precise approach to extract the strength of the coupling is necessary. For most qubit designs, the structure of the qubit typically remains in the electrically small regime. Therefore, simulation software based on static fields and the Method of Moments (MoM), such as Q3D, is still applicable in most instances. However, as the number of qubits on a chip increases, Q3D faces challenges in effectively addressing the complex coupling and crosstalk issues present on the chip. In this work, we extend the lumped-element-based qubit model by using microwave network parameters and thus enable the simulation of the qubit for the Finite Element Method (FEM)-based 3D electromagnetic simulation software, such as HFSS. This approach is suitable for the determination of the capacitive coupling strength between the qubit and the drive line, as well as readout circuits. Furthermore, to address the inductive coupling between the qubit and the flux line, we propose a method in this work that directly computes the mutual inductance, which is implemented by determining the magnetic flux through the DC SQUID area, generated by the current port excitation in HFSS. The proposed methodologies not only effectively extracts the key qubit design parameters, but also offer broader applicability for analysing complex crosstalk in multi-qubit chip designs.
AB - In the design of superconducting quantum chips, the control and readout of the quantum bit (qubit) are realized through interactions with other components in the circuit, such as drive lines, flux lines and readout resonator. Depending on the design, these interactions employ either an inductive or capacitive coupling scheme. Note that every interaction governs critical performance metrics for the chip, including gate fidelity, readout speed, and coherence times, a more effective and precise approach to extract the strength of the coupling is necessary. For most qubit designs, the structure of the qubit typically remains in the electrically small regime. Therefore, simulation software based on static fields and the Method of Moments (MoM), such as Q3D, is still applicable in most instances. However, as the number of qubits on a chip increases, Q3D faces challenges in effectively addressing the complex coupling and crosstalk issues present on the chip. In this work, we extend the lumped-element-based qubit model by using microwave network parameters and thus enable the simulation of the qubit for the Finite Element Method (FEM)-based 3D electromagnetic simulation software, such as HFSS. This approach is suitable for the determination of the capacitive coupling strength between the qubit and the drive line, as well as readout circuits. Furthermore, to address the inductive coupling between the qubit and the flux line, we propose a method in this work that directly computes the mutual inductance, which is implemented by determining the magnetic flux through the DC SQUID area, generated by the current port excitation in HFSS. The proposed methodologies not only effectively extracts the key qubit design parameters, but also offer broader applicability for analysing complex crosstalk in multi-qubit chip designs.
KW - FEM simulation
KW - coupling strength
KW - quantum engineering
KW - qubit modelling
KW - superconducting qubit
UR - http://www.scopus.com/inward/record.url?scp=85180003647&partnerID=8YFLogxK
U2 - 10.1109/QCE57702.2023.10246
DO - 10.1109/QCE57702.2023.10246
M3 - Conference contribution
AN - SCOPUS:85180003647
T3 - Proceedings - 2023 IEEE International Conference on Quantum Computing and Engineering, QCE 2023
SP - 288
EP - 289
BT - Proceedings - 2023 IEEE International Conference on Quantum Computing and Engineering, QCE 2023
A2 - Muller, Hausi
A2 - Alexev, Yuri
A2 - Delgado, Andrea
A2 - Byrd, Greg
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 4th IEEE International Conference on Quantum Computing and Engineering, QCE 2023
Y2 - 17 September 2023 through 22 September 2023
ER -