Examination of process parameter variations

Emrah Acar; Hendrik Mau; Andy Heinig; Bing Li; Ulf Schlichtmann

doi:10.1007/978-1-4419-6621-6_3

Examination of process parameter variations

Emrah Acar, Hendrik Mau, Andy Heinig, Bing Li, Ulf Schlichtmann

Chair of Electronic Design Automation

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

Abstract

Chapter 3 presents an overview on the sources of variations in the manufacturing process. Section 3.1 deals with the so-called Front-End Of Line (FEOL) variations that refer to the variations on the device level. Besides the extrinsic variability that is caused by the imperfections of the manufacturing process, the intrinsic variability due to atomic-level differences is gaining importance. At the nanoscale level, even an uncertainty of a few atoms may adversely affect the parameters and the behavior of microelectronic devices. Some details are going to be figured out in the first section of this chapter.

Original language	English
Title of host publication	Process Variations and Probabilistic Integrated Circuit Design
Publisher	Springer New York
Pages	69-89
Number of pages	21
Volume	9781441966216
ISBN (Electronic)	9781441966216
ISBN (Print)	144196620X, 9781441966209
DOIs	https://doi.org/10.1007/978-1-4419-6621-6_3
State	Published - 1 Sep 2012

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10.1007/978-1-4419-6621-6_3

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Examination of process parameter variations

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