Evaluation of thermal transient characterization methodologies for high-power LED applications

Stefan Müller; Thomas Zahner; Frank Singer; Gabriele Schrag; Gerhard Wachutka

doi:10.1016/j.mejo.2013.08.014

Evaluation of thermal transient characterization methodologies for high-power LED applications

Stefan Müller
, Thomas Zahner
, Frank Singer
, Gabriele Schrag
, Gerhard Wachutka

OSRAM Opto Semiconductors

Research output: Contribution to journal › Article › peer-review

6 Scopus citations

Abstract

In the past, thermal characterization methodologies for LED packages have mainly been derived from already existing solutions of the microelectronics industry. Within this paper, several issues regarding the determination of the junction-to-case thermal resistance R_thJC for LED packages are addressed. The new JESD51-14 standard is taken into consideration and especially the so called "point of separation" of the underlying dual-interface method is investigated. Experiments and finite element simulations were carried out in order to investigate the environmental influences on this crucial point. The investigations reveal that the point of separation changes depending on the thermal boundary condition at the case of the LED module, viz the quality of the package attach.

Original language	English
Pages (from-to)	1005-1010
Number of pages	6
Journal	Microelectronics Journal
Volume	44
Issue number	11
DOIs	https://doi.org/10.1016/j.mejo.2013.08.014
State	Published - Nov 2013

Keywords

JESD51-14 standard
Junction-to-case thermal resistance
LED package
Point of separation

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10.1016/j.mejo.2013.08.014

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@article{4adff5c2d06844bfa134fad8aeb0f04b,

title = "Evaluation of thermal transient characterization methodologies for high-power LED applications",

abstract = "In the past, thermal characterization methodologies for LED packages have mainly been derived from already existing solutions of the microelectronics industry. Within this paper, several issues regarding the determination of the junction-to-case thermal resistance RthJC for LED packages are addressed. The new JESD51-14 standard is taken into consideration and especially the so called {"}point of separation{"} of the underlying dual-interface method is investigated. Experiments and finite element simulations were carried out in order to investigate the environmental influences on this crucial point. The investigations reveal that the point of separation changes depending on the thermal boundary condition at the case of the LED module, viz the quality of the package attach.",

keywords = "JESD51-14 standard, Junction-to-case thermal resistance, LED package, Point of separation",

author = "Stefan M{\"u}ller and Thomas Zahner and Frank Singer and Gabriele Schrag and Gerhard Wachutka",

year = "2013",

month = nov,

doi = "10.1016/j.mejo.2013.08.014",

language = "English",

volume = "44",

pages = "1005--1010",

journal = "Microelectronics Journal",

issn = "0026-2692",

publisher = "Elsevier Ltd.",

number = "11",

}

TY - JOUR

T1 - Evaluation of thermal transient characterization methodologies for high-power LED applications

AU - Müller, Stefan

AU - Zahner, Thomas

AU - Singer, Frank

AU - Schrag, Gabriele

AU - Wachutka, Gerhard

PY - 2013/11

Y1 - 2013/11

N2 - In the past, thermal characterization methodologies for LED packages have mainly been derived from already existing solutions of the microelectronics industry. Within this paper, several issues regarding the determination of the junction-to-case thermal resistance RthJC for LED packages are addressed. The new JESD51-14 standard is taken into consideration and especially the so called "point of separation" of the underlying dual-interface method is investigated. Experiments and finite element simulations were carried out in order to investigate the environmental influences on this crucial point. The investigations reveal that the point of separation changes depending on the thermal boundary condition at the case of the LED module, viz the quality of the package attach.

AB - In the past, thermal characterization methodologies for LED packages have mainly been derived from already existing solutions of the microelectronics industry. Within this paper, several issues regarding the determination of the junction-to-case thermal resistance RthJC for LED packages are addressed. The new JESD51-14 standard is taken into consideration and especially the so called "point of separation" of the underlying dual-interface method is investigated. Experiments and finite element simulations were carried out in order to investigate the environmental influences on this crucial point. The investigations reveal that the point of separation changes depending on the thermal boundary condition at the case of the LED module, viz the quality of the package attach.

KW - JESD51-14 standard

KW - Junction-to-case thermal resistance

KW - LED package

KW - Point of separation

UR - https://www.scopus.com/pages/publications/84888001928

U2 - 10.1016/j.mejo.2013.08.014

DO - 10.1016/j.mejo.2013.08.014

M3 - Article

AN - SCOPUS:84888001928

SN - 0026-2692

VL - 44

SP - 1005

EP - 1010

JO - Microelectronics Journal

JF - Microelectronics Journal

IS - 11

ER -

Evaluation of thermal transient characterization methodologies for high-power LED applications

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Keywords

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