@inproceedings{152cd5a5769b4393aaab167fdbea3eb2,
title = "Evaluation of thermal transient characterization methodologies for high-power LED applications",
abstract = "In the past, thermal characterization methodologies for LED packages have mainly been derived from already existing solutions of the microelectronics industry. Within this paper, several issues regarding the determination of the junction-to-case thermal resistance R thJC for LED packages are addressed. The new JESD51-14 standard is taken into consideration and especially the so called point of separation of the underlying dual-interface method is investigated. Experiments and finite element simulations were carried out in order to investigate the environmental influences on this crucial point. The investigations reveal that the point of separation changes depending on the thermal boundary condition at the case of the LED module, viz the quality of the package attach.",
keywords = "JESD51-14 standard, Junction-to-case thermal resistance, LED package, point of separation",
author = "Stefan Muller and Thomas Zahner and Frank Singer and Gabriele Schrag and Gerhard Wachutka",
year = "2011",
language = "English",
isbn = "9782355000171",
series = "17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011",
pages = "104--109",
booktitle = "17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011",
note = "17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011 ; Conference date: 27-09-2011 Through 29-09-2011",
}