Evaluation of thermal transient characterization methodologies for high-power LED applications

Stefan Muller, Thomas Zahner, Frank Singer, Gabriele Schrag, Gerhard Wachutka

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

In the past, thermal characterization methodologies for LED packages have mainly been derived from already existing solutions of the microelectronics industry. Within this paper, several issues regarding the determination of the junction-to-case thermal resistance R thJC for LED packages are addressed. The new JESD51-14 standard is taken into consideration and especially the so called point of separation of the underlying dual-interface method is investigated. Experiments and finite element simulations were carried out in order to investigate the environmental influences on this crucial point. The investigations reveal that the point of separation changes depending on the thermal boundary condition at the case of the LED module, viz the quality of the package attach.

Original languageEnglish
Title of host publication17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011
Pages104-109
Number of pages6
StatePublished - 2011
Event17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011 - Paris, France
Duration: 27 Sep 201129 Sep 2011

Publication series

Name17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011

Conference

Conference17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011
Country/TerritoryFrance
CityParis
Period27/09/1129/09/11

Keywords

  • JESD51-14 standard
  • Junction-to-case thermal resistance
  • LED package
  • point of separation

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