Entwicklung einer integrierten mikroelektromechanischen Pumpe für mobile Anwendungen

Translated title of the contribution: Development of an integrated micro-electro-mechanical Pump for mobile Applications

Martin Seidl, Gabriele Schrag, David Tumpold

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

We present a micro-electro-mechanical pump for mobile applications, featuring up to one order of magnitude smaller surface area compared to state-of-the-art solutions. Chip edge lengths below 1,9 mm are accomplished using standardized MEMS manufacturing processes, enabling simple integration into mobile devices. Advanced finite element simulations are carried out in order to analyse the efficiency of the micropumps, as well as to identify the most auspicious design variants. Following these investigations, we developed a micropump concept with expected flow rates of 20 µl/min per mm3 device volume. On top of that, the compatibility to common, standardized semiconductor manufacturing techniques enables mass production with low production costs, and ensures consistent quality.

Translated title of the contributionDevelopment of an integrated micro-electro-mechanical Pump for mobile Applications
Original languageGerman
Title of host publicationMikroSystemTechnik Kongress 2019 - Mikroelektronik | MEMS-MOEMS | Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings
PublisherVDE VERLAG GMBH
Pages498-501
Number of pages4
ISBN (Electronic)9783800751297
StatePublished - 2019
EventMikroSystemTechnik Kongress 2019: Mikroelektronik, MEMS-MOEMS, Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz - MikroSystemTechnik Congress 2019: Microelectronics, MEMS-MOEMS, System Integration - Pillars of Digitization and Artificial Intelligence - Berlin, Germany
Duration: 28 Oct 201930 Oct 2019

Publication series

NameMikroSystemTechnik Kongress 2019 - Mikroelektronik MEMS-MOEMS Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz, Proceedings

Conference

ConferenceMikroSystemTechnik Kongress 2019: Mikroelektronik, MEMS-MOEMS, Systemintegration - Saulen der Digitalisierung und kunstlichen Intelligenz - MikroSystemTechnik Congress 2019: Microelectronics, MEMS-MOEMS, System Integration - Pillars of Digitization and Artificial Intelligence
Country/TerritoryGermany
CityBerlin
Period28/10/1930/10/19

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