TY - GEN
T1 - ENHANCEMENT OF VENDOR-MANAGED INVENTORY PLANNING THROUGH DEEP REINFORCEMENT LEARNING
AU - Ratusny, Marco
AU - Kim, Jee Hyung
AU - Sekiya, Hajime
AU - Schiffer, Maximilian
AU - Ehm, Hans
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - We explore the application of Twin Delayed Deep Deterministic Policy Gradient (TD3), a Deep Reinforcement Learning (DRL) algorithm, for optimizing Vendor-Managed Inventory (VMI) systems in the semiconductor industry. We introduce a novel multi-scenario DRL algorithm with a continuous action space, designed to effectively manage diverse product/customer combinations, thereby improving VMI performance. We evaluate our algorithm’s efficacy on three distinct products as well as 100 product/customer combinations for the multi-scenario approach. A sensitivity analysis examines the effects of varying shipment penalties on the percentage of no violations (PNV) and shipments. Our findings indicate that our DRL-based VMI model significantly surpasses existing policies used in the semiconductor industry by five percentage points.
AB - We explore the application of Twin Delayed Deep Deterministic Policy Gradient (TD3), a Deep Reinforcement Learning (DRL) algorithm, for optimizing Vendor-Managed Inventory (VMI) systems in the semiconductor industry. We introduce a novel multi-scenario DRL algorithm with a continuous action space, designed to effectively manage diverse product/customer combinations, thereby improving VMI performance. We evaluate our algorithm’s efficacy on three distinct products as well as 100 product/customer combinations for the multi-scenario approach. A sensitivity analysis examines the effects of varying shipment penalties on the percentage of no violations (PNV) and shipments. Our findings indicate that our DRL-based VMI model significantly surpasses existing policies used in the semiconductor industry by five percentage points.
UR - http://www.scopus.com/inward/record.url?scp=85217616908&partnerID=8YFLogxK
U2 - 10.1109/WSC63780.2024.10838627
DO - 10.1109/WSC63780.2024.10838627
M3 - Conference contribution
AN - SCOPUS:85217616908
T3 - Proceedings - Winter Simulation Conference
SP - 1749
EP - 1760
BT - 2024 Winter Simulation Conference, WSC 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 Winter Simulation Conference, WSC 2024
Y2 - 15 December 2024 through 18 December 2024
ER -