TY - GEN
T1 - Enhanced fluid flow by wavelike excitation of a micromechanical bending actuator
AU - Holzl, Wolfgang
AU - Behlert, Regine
AU - Gehring, Matthias
AU - Schrag, Gabriele
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/3
Y1 - 2019/3
N2 - We present a study on a micromechanical bending actuator, which is intended for creating fluid flow by a fish-like, undulatory motion. This motion pattern describes an ascending wave traveling along the actuator and is capable to shed vortices into the surrounding fluid, forming a vortex wake. A segmented electrode at the top of the bending actuator enables the undulatory excitation. It turns out, that undulation creates slightly higher mass flow than resonant oscillations in the structure's first eigenmode. At the same time, undulation needs less energy for generating equal mass flow, and, hence, is more efficient compared to resonant motion.
AB - We present a study on a micromechanical bending actuator, which is intended for creating fluid flow by a fish-like, undulatory motion. This motion pattern describes an ascending wave traveling along the actuator and is capable to shed vortices into the surrounding fluid, forming a vortex wake. A segmented electrode at the top of the bending actuator enables the undulatory excitation. It turns out, that undulation creates slightly higher mass flow than resonant oscillations in the structure's first eigenmode. At the same time, undulation needs less energy for generating equal mass flow, and, hence, is more efficient compared to resonant motion.
UR - http://www.scopus.com/inward/record.url?scp=85067512277&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE.2019.8724585
DO - 10.1109/EuroSimE.2019.8724585
M3 - Conference contribution
AN - SCOPUS:85067512277
T3 - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
BT - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
Y2 - 24 March 2019 through 27 March 2019
ER -