Enhanced design of microsystems by combining lumped and distributed system-level models

Gabriele Schrag, Thomas Kunzig, Alfons Dehe

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

7 Scopus citations

Abstract

We highlight the benefits of a tailored system-level modeling approach for the enhanced design of MEMS devices and systems demonstrated for an industrial capacitive silicon microphone. The performance of such microphones is determined by distributed effects like viscous damping and inhomogeneous capacitance variation across the membrane as well as by system-level phenomena like package-induced acoustical effects and the impact of the electronic circuitry for biasing and read-out. In order to meet these antipodal targets, a so-called mixed-level simulation approach is applied, which combines distributed and lumped element models on system-level. This provides maximum insight into the device and system operation while keeping the computational expense low. The presented model enables the investigation of the most relevant figures of merit such as the frequency response, the total harmonic distortion, and the signal-to-noise ratio as well as the analysis of their respective dependence on design parameters. The accuracy of the derived model and its potential for predictive simulation is assured by extensive calibration of each submodel and demonstrated through comparison to measured data.

Original languageEnglish
Title of host publicationSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016
EditorsYoshio Mita, Marta Rencz, Benoit Charlot, Peter Schneider, Niels Tas, Pascal Nouet, Francis Pressecq
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509014576
DOIs
StatePublished - 15 Jul 2016
Event18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016 - Budapest, Hungary
Duration: 30 May 20162 Jun 2016

Publication series

NameSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016

Conference

Conference18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016
Country/TerritoryHungary
CityBudapest
Period30/05/162/06/16

Keywords

  • compact models
  • Distributed models
  • multiphysics
  • silicon microphone
  • system-level modeling

Fingerprint

Dive into the research topics of 'Enhanced design of microsystems by combining lumped and distributed system-level models'. Together they form a unique fingerprint.

Cite this