Elektrochemische Migration - eine typische Korrosionserscheinung in der Mikroelektronik

Translated title of the contribution: Electromigration - a typical corrosion phenomenon in microelectronics

Kh G. Schmitt-Thomas, S. Wege, H. Schweigart

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

The most frequent failure of electronic components is electrochemical migration. As a consequence of the formation of humid films on contaminated printed circuit boards short cuts occur. To obtain an enhanced capacity the conductor spacings are reduced, promoting the danger of a fall out by short cuts. In this paper the main mechanisms of the electrochemical migration consisting of different reactions as metal solution, metal migration and metal deposition will be described in detail. Also methods to avoid electrochemical migration will be discussed.

Translated title of the contributionElectromigration - a typical corrosion phenomenon in microelectronics
Original languageGerman
Pages (from-to)366-369
Number of pages4
JournalMaterials and Corrosion
Volume46
Issue number6
StatePublished - Jun 1995

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