Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration

Nikhilendu Tiwary, Christian Grosse, Michael Kögel, Thilo Windemuth, Glenn Ross, Vesa Vuorinen, Sebastian Brand, Mervi Paulasto-Kröckel

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

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Keyphrases

Engineering

Material Science