@inproceedings{ffe8673a995345648c19d47a9620e284,
title = "Electro-thermo-mechanical field analysis using SESES",
abstract = "We describe our simulation framework for coupled electro-thermo-mechanical (ETM) analysis of miniaturized transducers and electronic devices. The package is tailored to the specific requirements of micro-electro-mechanical structure design. It achieves high computational accuracy and performance on engineering workstations through the use of an automatic mesh adaptation algorithm [1]. A zone-coupling scheme allows for a considerable reduction of degrees of freedom (Dofs). A fast linear solver coupled with near-optimal finite element data structures enables the solution of complex devices with up to 100,000 finite elements on a workstation.",
author = "J. Funk and Korvink, {J. G.} and G. Wachutka and H. Baltes",
note = "Publisher Copyright: {\textcopyright} 1994 Editions Frontieres.; 24th European Solid State Device Research Conference, ESSDERC 1994 ; Conference date: 11-09-1994 Through 15-09-1994",
year = "1994",
language = "English",
series = "European Solid-State Device Research Conference",
publisher = "IEEE Computer Society",
pages = "347--350",
editor = "Peter Ashburn and Chris Hill",
booktitle = "European Solid-State Device Research Conference",
}