Electrical phenomena during Hot Swap events

C. Trinitis, W. Karl, M. Leberecht

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

The exchange of a computer system's components during operation can be accomplished by the so called Hot Swap technology. This technology makes it possible to continuously run a computer system without the necessity of a shutdown for maintenance purposes, e.g. upgrading of a network adapter. Thus the overall uptime of a system can be drastically increased. The Hot Swap capability has been integrated into the so called CompactPCI technology. This paper summarizes the investigations that have been carried out with respect to the electrical behavior during Hot Swap events. Several simulations were performed with the H-SPICE program by AMP, Harrisburg, PA. After an introduction to live insertion phenomena in general, the CompactPCI specific simulations are described and recommendations for designing a Hot Swap capable system from an electrical point of view are given.

Original languageEnglish
Title of host publicationProceedings - PRDC 2000, 2000 Pacific Rim International Symposium on Dependable Computing
PublisherIEEE Computer Society
Pages19-26
Number of pages8
ISBN (Electronic)0769509754
DOIs
StatePublished - 2000
EventPacific Rim International Symposium on Dependable Computing, PRDC 2000 - Los Angeles, United States
Duration: 18 Dec 200020 Dec 2000

Publication series

NameProceedings of IEEE Pacific Rim International Symposium on Dependable Computing, PRDC
Volume2000-January
ISSN (Print)1541-0110

Conference

ConferencePacific Rim International Symposium on Dependable Computing, PRDC 2000
Country/TerritoryUnited States
CityLos Angeles
Period18/12/0020/12/00

Keywords

  • Backplanes
  • Computational modeling
  • Computer aided manufacturing
  • Computer industry
  • Computer networks
  • Computer simulation
  • Electrostatic discharge
  • Integrated circuit modeling
  • Semiconductor diodes
  • Voltage

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