TY - GEN
T1 - Efficient Time Domain Modeling of E.M. Coupling between Metallic Enclosures
AU - Lindenmeier, Stefan
AU - Pierantoni, Luca
AU - Russer, Peter
N1 - Publisher Copyright:
© 1999 ETH Zentrum - IKT.
PY - 1999
Y1 - 1999
N2 - In many Electromagnetic Compatibility (EMC) problems we have to deal with interacting objects of arbitrary shape placed in the same environment. The interaction among different equipments is particularly strong in presence of transient phenomena. In this contribution, we model the e.m. field of interacting objects in the time domain by means of a hybrid Transmission Line Matrix (TLM) method, based on Adapted Radiating Boundaries (ARB). The hybrid ARB method shows a high stability of the algorithm and a very fast computational time. It is especially suitable for the efficient simulation of transient electromagnetic interferences between various lossy structures of complex geometry. The ARB method is applied for the modeling of the e.m. coupling between metallic enclosures. In comparison to the TLM method, the ARB method yields considerable savings in computational effort.
AB - In many Electromagnetic Compatibility (EMC) problems we have to deal with interacting objects of arbitrary shape placed in the same environment. The interaction among different equipments is particularly strong in presence of transient phenomena. In this contribution, we model the e.m. field of interacting objects in the time domain by means of a hybrid Transmission Line Matrix (TLM) method, based on Adapted Radiating Boundaries (ARB). The hybrid ARB method shows a high stability of the algorithm and a very fast computational time. It is especially suitable for the efficient simulation of transient electromagnetic interferences between various lossy structures of complex geometry. The ARB method is applied for the modeling of the e.m. coupling between metallic enclosures. In comparison to the TLM method, the ARB method yields considerable savings in computational effort.
UR - http://www.scopus.com/inward/record.url?scp=84897550968&partnerID=8YFLogxK
U2 - 10.23919/EMC.1999.10791662
DO - 10.23919/EMC.1999.10791662
M3 - Conference contribution
AN - SCOPUS:84897550968
T3 - 13th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, EMC 1999
SP - 181
EP - 184
BT - 13th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, EMC 1999
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 13th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, EMC 1999
Y2 - 16 February 1999 through 18 February 1999
ER -