TY - GEN
T1 - Efficient Modeling of Acoustic Channels-Towards Tailored Frequency Response of Airborne Ultrasonic MEMS Transducers
AU - Bosetti, Gabriele
AU - Schrag, Gabriele
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - We present a fully-parametrized physics-based analytical methodology for the fast computation of the acoustic behavior of mm-sized circular acoustic channels with spatially varying radius. The presented algebraic method achieves accuracies comparable to state-of-The-Art FEM simulations for frequencies between 10 Hz and 100 kHz, while reducing the computational time by a factor of more than 3000. Thanks to its glass-box nature, this method can be used for a wide range of applications such as the design optimization of acoustic channels to achieve a target operating frequency for a given MEMS-based ultrasonic system as well as to tailor the shape of its entire frequency response.
AB - We present a fully-parametrized physics-based analytical methodology for the fast computation of the acoustic behavior of mm-sized circular acoustic channels with spatially varying radius. The presented algebraic method achieves accuracies comparable to state-of-The-Art FEM simulations for frequencies between 10 Hz and 100 kHz, while reducing the computational time by a factor of more than 3000. Thanks to its glass-box nature, this method can be used for a wide range of applications such as the design optimization of acoustic channels to achieve a target operating frequency for a given MEMS-based ultrasonic system as well as to tailor the shape of its entire frequency response.
UR - http://www.scopus.com/inward/record.url?scp=85129527946&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE54907.2022.9758906
DO - 10.1109/EuroSimE54907.2022.9758906
M3 - Conference contribution
AN - SCOPUS:85129527946
T3 - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
BT - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
Y2 - 25 April 2022 through 27 April 2022
ER -