Development of a model-based modular building kit for sensor-integrating machine elements—Theory and application

Jan Küchenhof, Richard Breimann, Eckhard Kirchner, Ilja Gomberg, Hoc Khiem Trieu, Kamal Alamsha, Erich Knoll, Karsten Stahl, Johannes Menning, Thomas Wallmersperger, Arthur Ewert, Berthold Schlecht, Artem Prokopchuk, E. F.Markus Henke, Stephanie Seltmann, Alexander Hasse, Chen Chen, Welf Guntram Drossel, Dieter Krause

Research output: Contribution to journalArticlepeer-review

Abstract

In the Priority Program 2305 of the German Research Foundation, so-called Sensor-integrating Machine Elements (SiME) are to be developed. These are essentially highly standardized components with integrated microelectronics. The present article presents the development of a model-based construction kit to support the design of integrated sensor systems for these new machine elements. A methodical procedure for collecting the development data required for modeling the modular building kit for SiME is presented and applied to four different cases within the project. Use cases, product structure and module diagrams were recorded and modeled for the machine elements screw, gear, coupling and feather key. These are then linked in SysML models to enable sensor systems for SiME to be configured in line with requirements. The modeling of the system architectures deepens the understanding of the underlying mechatronic system architecture and supports the identification of differentiation features as well as synergy potentials.

Translated title of the contributionEntwicklung eines modellbasierten Modulbaukastens für Sensorintegrierende Maschinenelemente – Theorie und Anwendung
Original languageEnglish
Article number40
JournalForschung im Ingenieurwesen/Engineering Research
Volume88
Issue number1
DOIs
StatePublished - Dec 2024

Fingerprint

Dive into the research topics of 'Development of a model-based modular building kit for sensor-integrating machine elements—Theory and application'. Together they form a unique fingerprint.

Cite this