TY - GEN
T1 - Design Studies and Optimization of Acoustic Pressure in Acoustofluidic Cell Manipulation Platforms
AU - Leikam, B.
AU - Pandey, S.
AU - Hayden, O.
AU - Schrag, G.
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Acoustofluidics, combining acoustics and microfluidics, is a growing field with applications in various scientific disciplines. It can be successfully applied in trapping and manipulating single cells for research towards the development of efficient drugs and medical treatments. We present a numerical study that investigates the effect of fluidics, geometrical and material properties, and acoustic frequencies on the confinement of cells using piezoelectric actuation in liquid-filled spherical microchambers assembled in an array configuration. The use of simple acoustic-fluidic chip configurations in combination with established microscopic methods bears immense potential for revolutionizing biomedical research and clinical diagnostics. Furthermore, arrays offer the advantage of parallelizing processes, resulting in significant time and cost savings.
AB - Acoustofluidics, combining acoustics and microfluidics, is a growing field with applications in various scientific disciplines. It can be successfully applied in trapping and manipulating single cells for research towards the development of efficient drugs and medical treatments. We present a numerical study that investigates the effect of fluidics, geometrical and material properties, and acoustic frequencies on the confinement of cells using piezoelectric actuation in liquid-filled spherical microchambers assembled in an array configuration. The use of simple acoustic-fluidic chip configurations in combination with established microscopic methods bears immense potential for revolutionizing biomedical research and clinical diagnostics. Furthermore, arrays offer the advantage of parallelizing processes, resulting in significant time and cost savings.
UR - http://www.scopus.com/inward/record.url?scp=85191174898&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE60745.2024.10491497
DO - 10.1109/EuroSimE60745.2024.10491497
M3 - Conference contribution
AN - SCOPUS:85191174898
T3 - 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
BT - 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
Y2 - 7 April 2024 through 10 April 2024
ER -