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Design-phase buffer allocation for post-silicon clock binning by iterative learning

  • Technical University of Munich
  • University of Notre Dame

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

At submicrometer manufacturing technology nodes, process variations affect circuit performance significantly. To counter these variations, engineers are reserving more timing margin to maintain yield, leading to an unaffordable overdesign. Most of these margins, however, are wasted after manufacturing, because process variations cause only some chips to be really slow, while other chips can easily meet given timing specifications. To reduce this pessimism, we can reserve less timing margin and tune failed chips after manufacturing with clock buffers to make them meet timing specifications. With this post-silicon clock tuning, critical paths can be balanced with neighboring paths in each chip specifically to counter the effect of process variations. Consequently, chips with timing failures can be rescued and the yield can thus be improved. This is specially useful in high-performance designs, e.g., high-end CPUs, where clock binning makes chips with higher performance much more profitable. In this paper, we propose a method to determine where to insert post-silicon tuning buffers during the design phase to improve the overall profit with clock binning. This method learns the buffer locations with a Sobol sequence iteratively and reduces the buffer ranges afterward with tuning concentration and buffer grouping. Experimental results demonstrate that the proposed method can achieve a profit improvement of about 14% on average and up to 26%, with only a small number of tuning buffers inserted into the circuit.

Original languageEnglish
Pages (from-to)392-405
Number of pages14
JournalIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Volume37
Issue number2
DOIs
StatePublished - Feb 2018

Keywords

  • Clock binning
  • Iterative learning
  • Post-silicon tuning
  • Process variations
  • Yield

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