TY - GEN
T1 - Design Optimization of a Corrugated Piezoelectric MEMS Microphone applying Genetic Algorithms
AU - Bosetti, Gabriele
AU - Bretthauer, Christian
AU - Bogner, Andreas
AU - Krenzer, Michael
AU - Gierl, Karolina
AU - Heiss, Heinrich
AU - Schrag, Gabriele
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - In this work we present an automated design optimization framework based on genetic algorithms to explore and assess the full potential of high-performance piezoelectric MEMS microphones. The novel device concept is based on fully clamped, corrugated aluminum nitride (AlN) membranes with a high number of geometrical degrees of freedom. The key performance parameters are extracted with the help of finite element simulations, while the whole optimization flow is controlled with MATLAB. We show that this method enables a wide search within the parameter space and helps in finding optimal microphone designs with improved performance compared to device variants conceived purely by engineering intuition.
AB - In this work we present an automated design optimization framework based on genetic algorithms to explore and assess the full potential of high-performance piezoelectric MEMS microphones. The novel device concept is based on fully clamped, corrugated aluminum nitride (AlN) membranes with a high number of geometrical degrees of freedom. The key performance parameters are extracted with the help of finite element simulations, while the whole optimization flow is controlled with MATLAB. We show that this method enables a wide search within the parameter space and helps in finding optimal microphone designs with improved performance compared to device variants conceived purely by engineering intuition.
UR - http://www.scopus.com/inward/record.url?scp=85191176517&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE60745.2024.10491462
DO - 10.1109/EuroSimE60745.2024.10491462
M3 - Conference contribution
AN - SCOPUS:85191176517
T3 - 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
BT - 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
Y2 - 7 April 2024 through 10 April 2024
ER -