Design of an integrated piezoelectric micro-flapper based on bionic principles

Regine Behlert, Gabriele Schrag, Gerhard Wachutka, Robert Wieland, Christoph Kutter

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

We present a novel micromachined piezoelectric actuator structure, which effects directed large area fluid transport on chip-level and is supposed to be used for venting or cooling applications. The design of the actuator is inspired by the bionic principle of fish locomotion and the flight characteristics of small insects. An intricate superposition of translatory and rotatory motion of a fin-or wing-like structure leads to an undulatory motion of the mechanical structure. This, in turn, induces vortices in the surrounding fluid, which overlap and eventually form a chain of vortices (so-called wake) that generates a strong axial jet stream pointing away from the vibrating flap. The momentum transfer effected thereby on the fluid results in directed flow of mass and convective heat. For the technological realization of this concept, we selected an existing industrial piezoelectric thin film process as material basis and designed a twin-cantilever actuator element with large lateral areas featuring large deflections. Coupled energy domain ("multiphysics") FEM analysis has been carried out with a view to specifying the over-all geometry and the extension, location, and shape of the electrodes. The bundle of design variants derived from the theoretical analysis and the results of the finite element calculations are currently on their way to be cast in hardware.

Original languageEnglish
Title of host publicationSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016
EditorsYoshio Mita, Marta Rencz, Benoit Charlot, Peter Schneider, Niels Tas, Pascal Nouet, Francis Pressecq
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509014576
DOIs
StatePublished - 15 Jul 2016
Event18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016 - Budapest, Hungary
Duration: 30 May 20162 Jun 2016

Publication series

NameSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016

Conference

Conference18th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016
Country/TerritoryHungary
CityBudapest
Period30/05/162/06/16

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