Design of a Micropump Based on an Industrial Microphone Manufacturing Process

Martin Seidl; Gabriele Schrag; Wolfgang Klein; Matthias Vobl; Ulrich Krumbein

doi:10.1109/DTIP.2019.8752688

Design of a Micropump Based on an Industrial Microphone Manufacturing Process

Martin Seidl
, Gabriele Schrag
, Wolfgang Klein
, Matthias Vobl
, Ulrich Krumbein

Associate Professorship of Microsensors and Actuators

Technical University of Munich
Infineon Technologies AG

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

We present a micro-electro-mechanical pump design, up to one order of magnitude smaller in surface area compared to state-of-the-art solutions. After identifying a standard MEMS microphone manufacturing process as suitable vantage point for the production of an integrated micropump, designs with device edge lengths below 1.9 mm are implemented. Sophisticated finite element simulations including full electro-mechanical-fluidic coupling and mechanical contact are carried out in order to support the development and to identify the most promising and efficient device variants. This approach results in a micropump concept with expected flow rates in the range of 20 μl/min per mm³ device volume.

Original language	English
Title of host publication	2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728132860
DOIs	https://doi.org/10.1109/DTIP.2019.8752688
State	Published - May 2019
Event	2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019 - Paris, France Duration: 12 May 2019 → 15 May 2019

Publication series

Name	2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019

Conference

Conference	2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019
Country/Territory	France
City	Paris
Period	12/05/19 → 15/05/19

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

MEMS
actuator
electrostatic
integrated
process adaptation
pump

Access to Document

10.1109/DTIP.2019.8752688

Cite this

Seidl, M., Schrag, G., Klein, W., Vobl, M., & Krumbein, U. (2019). Design of a Micropump Based on an Industrial Microphone Manufacturing Process. In 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019 Article 8752688 (2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DTIP.2019.8752688

Seidl, Martin ; Schrag, Gabriele ; Klein, Wolfgang et al. / Design of a Micropump Based on an Industrial Microphone Manufacturing Process. 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. (2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019).

@inproceedings{fff05828fda04f0d83df0d09cf70b4cf,

title = "Design of a Micropump Based on an Industrial Microphone Manufacturing Process",

abstract = "We present a micro-electro-mechanical pump design, up to one order of magnitude smaller in surface area compared to state-of-the-art solutions. After identifying a standard MEMS microphone manufacturing process as suitable vantage point for the production of an integrated micropump, designs with device edge lengths below 1.9 mm are implemented. Sophisticated finite element simulations including full electro-mechanical-fluidic coupling and mechanical contact are carried out in order to support the development and to identify the most promising and efficient device variants. This approach results in a micropump concept with expected flow rates in the range of 20 μl/min per mm3 device volume.",

keywords = "MEMS, actuator, electrostatic, integrated, process adaptation, pump",

author = "Martin Seidl and Gabriele Schrag and Wolfgang Klein and Matthias Vobl and Ulrich Krumbein",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019 ; Conference date: 12-05-2019 Through 15-05-2019",

year = "2019",

month = may,

doi = "10.1109/DTIP.2019.8752688",

language = "English",

series = "2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019",

}

Seidl, M, Schrag, G, Klein, W, Vobl, M & Krumbein, U 2019, Design of a Micropump Based on an Industrial Microphone Manufacturing Process. in 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019., 8752688, 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019, Institute of Electrical and Electronics Engineers Inc., 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019, Paris, France, 12/05/19. https://doi.org/10.1109/DTIP.2019.8752688

Design of a Micropump Based on an Industrial Microphone Manufacturing Process. / Seidl, Martin; Schrag, Gabriele; Klein, Wolfgang et al.
2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 8752688 (2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Design of a Micropump Based on an Industrial Microphone Manufacturing Process

AU - Seidl, Martin

AU - Schrag, Gabriele

AU - Klein, Wolfgang

AU - Vobl, Matthias

AU - Krumbein, Ulrich

PY - 2019/5

Y1 - 2019/5

N2 - We present a micro-electro-mechanical pump design, up to one order of magnitude smaller in surface area compared to state-of-the-art solutions. After identifying a standard MEMS microphone manufacturing process as suitable vantage point for the production of an integrated micropump, designs with device edge lengths below 1.9 mm are implemented. Sophisticated finite element simulations including full electro-mechanical-fluidic coupling and mechanical contact are carried out in order to support the development and to identify the most promising and efficient device variants. This approach results in a micropump concept with expected flow rates in the range of 20 μl/min per mm3 device volume.

AB - We present a micro-electro-mechanical pump design, up to one order of magnitude smaller in surface area compared to state-of-the-art solutions. After identifying a standard MEMS microphone manufacturing process as suitable vantage point for the production of an integrated micropump, designs with device edge lengths below 1.9 mm are implemented. Sophisticated finite element simulations including full electro-mechanical-fluidic coupling and mechanical contact are carried out in order to support the development and to identify the most promising and efficient device variants. This approach results in a micropump concept with expected flow rates in the range of 20 μl/min per mm3 device volume.

KW - MEMS

KW - actuator

KW - electrostatic

KW - integrated

KW - process adaptation

KW - pump

UR - https://www.scopus.com/pages/publications/85069490660

U2 - 10.1109/DTIP.2019.8752688

DO - 10.1109/DTIP.2019.8752688

M3 - Conference contribution

AN - SCOPUS:85069490660

T3 - 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019

BT - 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019

Y2 - 12 May 2019 through 15 May 2019

ER -

Seidl M, Schrag G, Klein W, Vobl M, Krumbein U. Design of a Micropump Based on an Industrial Microphone Manufacturing Process. In 2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8752688. (2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019). doi: 10.1109/DTIP.2019.8752688

Design of a Micropump Based on an Industrial Microphone Manufacturing Process

Abstract

Publication series

Conference

UN SDGs

Keywords

Access to Document

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