Design of a Micropump Based on an Industrial Microphone Manufacturing Process

Martin Seidl, Gabriele Schrag, Wolfgang Klein, Matthias Vobl, Ulrich Krumbein

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

We present a micro-electro-mechanical pump design, up to one order of magnitude smaller in surface area compared to state-of-the-art solutions. After identifying a standard MEMS microphone manufacturing process as suitable vantage point for the production of an integrated micropump, designs with device edge lengths below 1.9 mm are implemented. Sophisticated finite element simulations including full electro-mechanical-fluidic coupling and mechanical contact are carried out in order to support the development and to identify the most promising and efficient device variants. This approach results in a micropump concept with expected flow rates in the range of 20 μl/min per mm3 device volume.

Original languageEnglish
Title of host publication2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728132860
DOIs
StatePublished - May 2019
Event2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019 - Paris, France
Duration: 12 May 201915 May 2019

Publication series

Name2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019

Conference

Conference2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019
Country/TerritoryFrance
CityParis
Period12/05/1915/05/19

Keywords

  • MEMS
  • actuator
  • electrostatic
  • integrated
  • process adaptation
  • pump

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