Abstract
The changes occurring in a eutectic SnAg solder alloy due to the addition of lead will be described. The melting temperature of the alloy decreases with increasing lead content. Already at very small lead contents a ternary eutectic reaction takes place at 178 °C leading to partial melting of the samples.
| Translated title of the contribution | The influence of leod on eutectic SnAg3,5 solder alloy |
|---|---|
| Original language | German |
| Pages (from-to) | 633-635 |
| Number of pages | 3 |
| Journal | Metall |
| Volume | 50 |
| Issue number | 10 |
| State | Published - Oct 1996 |