Connecting the physical and application level towards grasping aging effects

Hussam Amrouch, Javier Martin-Martinez, Victor M. Van Santen, Miquel Moras, Rosana Rodriguez, Montserrat Nafria, Jörg Henkel

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

22 Scopus citations

Abstract

Technology scaling noticeably increases the susceptibility of transistors to varied degradations induced by aging phenomena like Bias Temperature Instability (BTI) and Time-Dependent-Dielectric Breakdown (TDDB). Therefore, estimating the reliability of an entire computational system necessitates investigating how such phenomena will ultimately lead to failures - considering that aging starts from the physical level and ends up at the application level, where workloads (i.e. software programs) run. The key challenge is that an accurate estimation imposes analyzing the impact of aging on each individual transistor within a sophisticated on-chip system using complex physics-based models. The latter requires both a careful experimental model parameter derivation for calibration and precise information regarding the actual temperature voltage-stress waveforms that may be applied to the transistors during lifetime. These waveforms are directly driven by the running workloads creating the inevitable necessity to connect the physical and application level. As a matter of fact, this challenge is exacerbated in the nano era, due to the typical workloads (i.e. multiple applications running in parallel along with an operating system) that may run on top of a tremendous number of transistors. This paper investigates this challenge to provide designers with an abstracted, yet sufficiently accurate reliability estimation that takes into account the interrelations between the physical and application level towards grasping how aging actually degrades the reliability of on-chip systems.

Original languageEnglish
Title of host publication2015 IEEE International Reliability Physics Symposium, IRPS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages3D11-3D18
ISBN (Electronic)9781467373623
DOIs
StatePublished - 26 May 2015
Externally publishedYes
EventIEEE International Reliability Physics Symposium, IRPS 2015 - Monterey, United States
Duration: 19 Apr 201523 Apr 2015

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
Volume2015-May
ISSN (Print)1541-7026

Conference

ConferenceIEEE International Reliability Physics Symposium, IRPS 2015
Country/TerritoryUnited States
CityMonterey
Period19/04/1523/04/15

Fingerprint

Dive into the research topics of 'Connecting the physical and application level towards grasping aging effects'. Together they form a unique fingerprint.

Cite this