TY - GEN
T1 - Connecting different worlds - Technology abstraction for reliability-aware design and Test
AU - Schlichtmann, Ulf
AU - Kleeberger, Veit B.
AU - Abraham, Jacob A.
AU - Evans, Adrian
AU - Gimmler-Dumon, Christina
AU - Glaß, Michael
AU - Herkersdorf, Andreas
AU - Nassif, Sani R.
AU - Wehn, Norbert
PY - 2014
Y1 - 2014
N2 - The rapid shrinking of device geometries in the nanometer regime requires new technology-aware design methodologies. These must be able to evaluate the resilience of the circuit throughout all System on Chip (SoC) abstraction levels. To successfully guide design decisions at the system level, reliability models, which abstract technology information, are required to identify those parts of the system where additional protection in the form of hardware or software coun-termeasures is most effective. Interfaces such as the presented Resilience Articulation Point (RAP) or the Reliability Interchange Information Format (RIIF) are required to enable EDA-assisted analysis and propagation of reliability information. The models are discussed from different perspectives, such as design and test.
AB - The rapid shrinking of device geometries in the nanometer regime requires new technology-aware design methodologies. These must be able to evaluate the resilience of the circuit throughout all System on Chip (SoC) abstraction levels. To successfully guide design decisions at the system level, reliability models, which abstract technology information, are required to identify those parts of the system where additional protection in the form of hardware or software coun-termeasures is most effective. Interfaces such as the presented Resilience Articulation Point (RAP) or the Reliability Interchange Information Format (RIIF) are required to enable EDA-assisted analysis and propagation of reliability information. The models are discussed from different perspectives, such as design and test.
UR - http://www.scopus.com/inward/record.url?scp=84903832702&partnerID=8YFLogxK
U2 - 10.7873/DATE2014.265
DO - 10.7873/DATE2014.265
M3 - Conference contribution
AN - SCOPUS:84903832702
SN - 9783981537024
T3 - Proceedings -Design, Automation and Test in Europe, DATE
BT - Proceedings - Design, Automation and Test in Europe, DATE 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 17th Design, Automation and Test in Europe, DATE 2014
Y2 - 24 March 2014 through 28 March 2014
ER -