Connecting different worlds - Technology abstraction for reliability-aware design and Test

Ulf Schlichtmann, Veit B. Kleeberger, Jacob A. Abraham, Adrian Evans, Christina Gimmler-Dumon, Michael Glaß, Andreas Herkersdorf, Sani R. Nassif, Norbert Wehn

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

The rapid shrinking of device geometries in the nanometer regime requires new technology-aware design methodologies. These must be able to evaluate the resilience of the circuit throughout all System on Chip (SoC) abstraction levels. To successfully guide design decisions at the system level, reliability models, which abstract technology information, are required to identify those parts of the system where additional protection in the form of hardware or software coun-termeasures is most effective. Interfaces such as the presented Resilience Articulation Point (RAP) or the Reliability Interchange Information Format (RIIF) are required to enable EDA-assisted analysis and propagation of reliability information. The models are discussed from different perspectives, such as design and test.

Original languageEnglish
Title of host publicationProceedings - Design, Automation and Test in Europe, DATE 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9783981537024
DOIs
StatePublished - 2014
Event17th Design, Automation and Test in Europe, DATE 2014 - Dresden, Germany
Duration: 24 Mar 201428 Mar 2014

Publication series

NameProceedings -Design, Automation and Test in Europe, DATE
ISSN (Print)1530-1591

Conference

Conference17th Design, Automation and Test in Europe, DATE 2014
Country/TerritoryGermany
CityDresden
Period24/03/1428/03/14

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