Condition monitoring for the Binder Jetting AM-process with machine learning approaches

Daniel Gunther; Mina Fahimi Pirehgalin; Iris Weis; Birgit Vogel-Heuser

doi:10.1109/ICPS48405.2020.9274716

Condition monitoring for the Binder Jetting AM-process with machine learning approaches

Daniel Gunther, Mina Fahimi Pirehgalin, Iris Weis, Birgit Vogel-Heuser

Chair of Automation and Information Systems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

7 Scopus citations

Abstract

Binder jetting is an Additive manufacturing process of increasing industrial importance. The printhead performance is largely responsible for the component properties. A reliable and simple analysis tool is missing for this. This article shows the first results of the application of a measurement method based on camera images that does not require reference images.

Original language	English
Title of host publication	Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	417-420
Number of pages	4
ISBN (Electronic)	9781728163895
DOIs	https://doi.org/10.1109/ICPS48405.2020.9274716
State	Published - 10 Jun 2020
Event	3rd IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020 - Virtual, Tampere, Finland Duration: 10 Jun 2020 → 12 Jun 2020

Publication series

Name	Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020

Conference

Conference	3rd IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020
Country/Territory	Finland
City	Virtual, Tampere
Period	10/06/20 → 12/06/20

Keywords

binder jetting
condition monitoring
image analysis

Access to Document

10.1109/ICPS48405.2020.9274716

Cite this

Gunther, D., Pirehgalin, M. F., Weis, I., & Vogel-Heuser, B. (2020). Condition monitoring for the Binder Jetting AM-process with machine learning approaches. In Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020 (pp. 417-420). Article 9274716 (Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICPS48405.2020.9274716

Gunther, Daniel ; Pirehgalin, Mina Fahimi ; Weis, Iris et al. / Condition monitoring for the Binder Jetting AM-process with machine learning approaches. Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020. Institute of Electrical and Electronics Engineers Inc., 2020. pp. 417-420 (Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020).

@inproceedings{bb8a9dd441994f21aec4e3f7fbe64a5f,

title = "Condition monitoring for the Binder Jetting AM-process with machine learning approaches",

abstract = "Binder jetting is an Additive manufacturing process of increasing industrial importance. The printhead performance is largely responsible for the component properties. A reliable and simple analysis tool is missing for this. This article shows the first results of the application of a measurement method based on camera images that does not require reference images.",

keywords = "binder jetting, condition monitoring, image analysis",

author = "Daniel Gunther and Pirehgalin, {Mina Fahimi} and Iris Weis and Birgit Vogel-Heuser",

note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 3rd IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020 ; Conference date: 10-06-2020 Through 12-06-2020",

year = "2020",

month = jun,

day = "10",

doi = "10.1109/ICPS48405.2020.9274716",

language = "English",

series = "Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "417--420",

booktitle = "Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020",

}

Gunther, D, Pirehgalin, MF, Weis, I & Vogel-Heuser, B 2020, Condition monitoring for the Binder Jetting AM-process with machine learning approaches. in Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020., 9274716, Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020, Institute of Electrical and Electronics Engineers Inc., pp. 417-420, 3rd IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020, Virtual, Tampere, Finland, 10/06/20. https://doi.org/10.1109/ICPS48405.2020.9274716

Condition monitoring for the Binder Jetting AM-process with machine learning approaches. / Gunther, Daniel; Pirehgalin, Mina Fahimi; Weis, Iris et al.
Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020. Institute of Electrical and Electronics Engineers Inc., 2020. p. 417-420 9274716 (Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Condition monitoring for the Binder Jetting AM-process with machine learning approaches

AU - Gunther, Daniel

AU - Pirehgalin, Mina Fahimi

AU - Weis, Iris

AU - Vogel-Heuser, Birgit

PY - 2020/6/10

Y1 - 2020/6/10

N2 - Binder jetting is an Additive manufacturing process of increasing industrial importance. The printhead performance is largely responsible for the component properties. A reliable and simple analysis tool is missing for this. This article shows the first results of the application of a measurement method based on camera images that does not require reference images.

AB - Binder jetting is an Additive manufacturing process of increasing industrial importance. The printhead performance is largely responsible for the component properties. A reliable and simple analysis tool is missing for this. This article shows the first results of the application of a measurement method based on camera images that does not require reference images.

KW - binder jetting

KW - condition monitoring

KW - image analysis

UR - http://www.scopus.com/inward/record.url?scp=85098718057&partnerID=8YFLogxK

U2 - 10.1109/ICPS48405.2020.9274716

DO - 10.1109/ICPS48405.2020.9274716

M3 - Conference contribution

AN - SCOPUS:85098718057

T3 - Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020

SP - 417

EP - 420

BT - Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 3rd IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020

Y2 - 10 June 2020 through 12 June 2020

ER -

Gunther D, Pirehgalin MF, Weis I, Vogel-Heuser B. Condition monitoring for the Binder Jetting AM-process with machine learning approaches. In Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020. Institute of Electrical and Electronics Engineers Inc. 2020. p. 417-420. 9274716. (Proceedings - 2020 IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020). doi: 10.1109/ICPS48405.2020.9274716

Condition monitoring for the Binder Jetting AM-process with machine learning approaches

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