COMPUTER AIDED QUANTITATIVE DETERMINATION OF THE SOLDERABILITY.

Kh G. Schmitt-Thomas, H. M. Zahel, U. C. Knott

Research output: Contribution to conferencePaperpeer-review

Abstract

Solderability testing of components is usually based on measurement of the time of contact with molten solder to achieve good wetting under given test conditions. Since wetting of a surface by molten solder involves a change in the surface tension forces due to interaction of the solder, flux and base metal, monitoring of the forces acting on a specimen as it becomes wetted serves as a method for solderability measurement. At every point of the soldering process, the surface tension balance makes it possible to achieve quantitative results.

Original languageEnglish
PagesA. 10. 1-A. 10. 5
StatePublished - 1984

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