Comparative study of contact topographies of 4.5kV SiC MPS diodes for optimizing the forward characteristics

Yaren Huang, Gerhard Wachutka

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

7 Scopus citations

Abstract

The forward characteristics of MPS diodes is composed of two branches: the first one is determined by unipolar conductivity originating from the Schottky contact, while the second one arises from hole injection by the Ohmic contact. A high ratio Ws/Wo of the Schottky contact area Ws to the Ohmic contact area Wo results in high unipolar conductivity and, thus, less heat dissipation under normal operation condition. But the bipolar injection efficiency is too law to support a high surge current capability. We attempt to give some guidelines how these two complementary functional principles can be combined with a view to finding optimum trade-offs for given customer-defined specifications, such as blocking voltage, nominal forward current, and surge current capability. In this work, several novel contact topographies are investigated using comprehensive 2D and 3D computer simulation to analyze consecutive improvements of the trade-off between regular (nominal) operation and surge mode, These TCAD simulations provide a physical understanding of the inner electronic device behavior of each topography considered and lead us eventually to novel concepts.

Original languageEnglish
Title of host publication2016 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2016
EditorsPeter Pichler, Eberhard Bar, Jurgen Lorenz
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages117-120
Number of pages4
ISBN (Electronic)9781509008179
DOIs
StatePublished - 20 Oct 2016
Event2016 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2016 - Nuremberg, Germany
Duration: 6 Sep 20168 Sep 2016

Publication series

NameInternational Conference on Simulation of Semiconductor Processes and Devices, SISPAD

Conference

Conference2016 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2016
Country/TerritoryGermany
CityNuremberg
Period6/09/168/09/16

Fingerprint

Dive into the research topics of 'Comparative study of contact topographies of 4.5kV SiC MPS diodes for optimizing the forward characteristics'. Together they form a unique fingerprint.

Cite this