Co-simulation and co-design of chip-package-board interfaces in highly-integrated RF systems

V. Issakov, M. Wojnowski, H. Knapp, S. Trotta, H. P. Forstner, K. Pressel, A. Hagelauer

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

12 Scopus citations

Abstract

The level of integration for RF and mm-wave systems is continuously increasing. Highly-integrated system on chip solutions have to be encapsulated in a package and assembled on a board. In addition, to be more attractive as a product, the trend goes towards further integration of passives and antennas in a package. This drives the system in package solutions. However, electrical properties of the package and board may have a significant effect on system parameters, especially at high frequencies. Hence, layout features of package and board must be carefully modelled and considered during the design. Furthermore, it is often insufficient to model chip, package and board separately, as some high-frequency effects may not be captured. An example is electromagnetic coupling between integrated coils on chip and routing traces in package. In this paper we describe considerations on co-simulation and co-design of highly-integrated RF systems by means of accurate electromagnetic modelling. We demonstrate the approach and various aspects of chip-package-board co-design based on examples of systems for various applications: 6 GHz VCO using embedded inductor; backhaul communication system in package for V-band and E-band and a four-channel 77 GHz automotive radar transceiver in a package with four dipole antennas.

Original languageEnglish
Title of host publication2016 IEEE Bipolar/BiCMOS Circuits and Technology Meeting, BCTM 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages94-101
Number of pages8
ISBN (Electronic)9781509004843
DOIs
StatePublished - 8 Nov 2016
Externally publishedYes
Event2016 IEEE Bipolar/BiCMOS Circuits and Technology Meeting, BCTM 2016 - New Brunswick, United States
Duration: 25 Sep 201627 Sep 2016

Publication series

NameProceedings of the IEEE Bipolar/BiCMOS Circuits and Technology Meeting
Volume2016-November
ISSN (Print)1088-9299

Conference

Conference2016 IEEE Bipolar/BiCMOS Circuits and Technology Meeting, BCTM 2016
Country/TerritoryUnited States
CityNew Brunswick
Period25/09/1627/09/16

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